The Failure Analysis is to analyze the root cause of
failure, problems in design issues, assembly issues and silicon issues, the
global failure analysis market is expected to grow at a compound annual growth
rate (CAGR) of 7.95% and reach US$8.3 billion by 2022 from $4.51 billion in
2014.
Some of the key drivers include industrial
advancement and increasing Applications of Failure Analysis. High Equipment and
maintenance cost are the restraint factors for the growth of market.
Global Failure Analysis market is segmented by
Technology, by Equipment, by Applications, and by Geography. Depending on the
Technology, market is segregated into Broad ion milling (BIM), Focused ion beam
(FIB), Reactive ion etching (RIE), Secondary ion mass spectroscopy (SIMS),
Energy dispersive X-ray spectroscopy (EDX) and Chemical mechanical
planarization (CMP). Based on Equipment, market is classified into Transmission
electron microscope (TEM), Focused ion beam system (FIB), Scanning electron
microscope (SEM) and Dual - Beam (FIB/SEM). Based on Application, market is
categorized into Bio Science, Material Science, Industrial & Electronics,
Fiber optics, Nanotechnology, nonmaterial’s and Polymers. Failure Analysis
market by geography is segmented into North America, Europe, Asia Pacific and
Rest of the World.
The Key players in the market include, JEOL, Ltd.,
FEI Company, Tescan, Hitachi High- Technologies, Carl Zeiss SMT GmbH, EAG
(Evans Analytical Group) Inc., Motion X Corporation, Intertek Group Plc,
A&D Company Ltd.
For more information visit: http://www.marketresearchreports.com/stratistics-mrc/global-failure-analysis-market-outlook-2014-2022
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