Global System-in-Package Market to grow at a CAGR of 10.29% during the period 2016 - 2020; Finds New Report

Report forecast the global SiP market to grow at a CAGR of 10.29% during the period 2016-2020.

A SiP contains several chips such as a specialized processor, dynamic random access memory (DRAM), and flash memory. These chips are combined with passive components such as resistors and capacitors, which are placed on one substrate, requiring only a few external components to make it functional. Thus, devices packaged using this technology are ideal for space constrained environments such as smart devices. This reduces integration complexities on the printed circuit board (PCB) as well as making the overall design simpler.

The report covers the present scenario and the growth prospects of the global SiP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of SiP systems.

The market is divided into the following segments based on geography:

• Americas
• APAC
• EMEA

According to the report, the increasing requirement in the semiconductor market to offer cost-effective and efficient semiconductor products is driving the demand for SiP packaging technology. The utilization of copper wires instead of the conventional gold wires for the connections within the chips in 3D semiconductor packaging is allowing vendors to reduce their costs significantly.

Further, the report states that the semiconductor packaging vendors are affected by the fluctuating foreign exchange rates due to the need of importing and exporting raw material across the globe. The instability of the world economy such as the slowdown of the Chinese economy and Britain's exit from the EU has led to volatile and unpredictable exchange rates. As a result, global players in the market are not able to anticipate future conditions and are likely to incur significant monetary losses in international trade.

Global SiP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

key players in the global SiP market: Amkor Technology, ASE, JCET, SPIL, and UTAC

Other prominent vendors in the market are: ChipMOS Technology, ChipSiP Technology, NANIUM, Octavo Systems, and Samsung Electro-Mechanics.

Market driver

• Need to control rising costs
• For a full, detailed list, view our report

Market challenge

• High inventory levels in supply chain
• For a full, detailed list, view our report

Market trend

• Growth of OSAT vendors
• For a full, detailed list, view our report

Key questions answered in this report

• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

Spanning over 67 pages and 38 Exhibits “Global System-in-Package Market 2016 - 2020” report covers Executive summary, Scope of the report, Market research methodology, Introduction, Market landscape, Technology overview, Market segmentation by application, Market segmentation by interconnect technology, Market segmentation by end-user, Geographical segmentation, Market drivers, Impact of drivers, Market challenges, Impact of drivers and challenges, Market trends, Vendor landscape, Appendix.

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